IC Package Layout Engineer

The Tesla AI Hardware team is at the forefront of revolutionizing artificial intelligence through cutting-edge hardware innovation. Comprising brilliant engineers and visionaries, the team designs and develops advanced AI inference chips tailored to accelerate Tesla's machine learning capabilities. A key part of this effort is Dojo, Tesla's custom supercomputer system built to efficiently train massive neural networks on vast video data from the fleet. The work of Tesla's AI Hardware team powers the neural networks behind Full Self-Driving (FSD), and Tesla humanoid robot, Optimus, pushing the boundaries of computational efficiency and performance. By creating custom silicon and optimized architectures, the team ensures Tesla remains a leader in AI-driven automotive and energy solutions, shaping a future where intelligent machines enhance human life.

As a key member of the Tesla AI Hardware team, the IC Packaging Layout Engineer will own package substrate and layout design for custom AI silicon used in Dojo, FSD, and Optimus. This role covers high-density interconnect layout, signal/power integrity, aware floorplanning, stack-up definition, and close collaboration with silicon, package, and board teams to meet performance, power, thermals, and manufacturability targets. The ideal candidate brings hands-on experience with advanced packaging (e.g., multi-chip modules, high-speed SerDes, dense BGA/LGA), layout tools and DRC/LVS flows, and a practical focus on delivering robust, production-ready package designs that scale Tesla's AI hardware

• Feasibility Study: Review and optimize die floor plan, bump pattern. Perform fan-out study. Estimate package layer count, and package size
• Design: Set up layers stackup, design constraints (Physical, Space and Electrical), optimize design based on design review and SI/PI simulation result
• Review/validation: Conduct DRC/DFM check based on design rules. Perform LVS check based on Verilog netlist and schematic
• Documentation: Generate all required package design documentations for review and release

• 5-10 years hands on experiences on IC package substrate layout
• Proficient in Cadence APD+ and SiP Layout
• Experience on fan-out, BGA, bump optimization
• Basic transmission line theory, signal and power integrity fundamentals
• Package RLGC, s parameter, IL/RL, x-talk extraction is a plus
• 2.5D package, 3DIC, SoC to DDR/HBM memory connection on package experience is a plus
• System capture, schematic driven design
• Familiar with Unix, Python, tcl, and package design automations
• Degree in Electrical Engineering, Mechanical Engineering or Materials Science or related field or equivalent experience
• Proficiency in programming languages such as C/C++ and Python, with applications in hardware simulation, modeling, or system-level software

Along with competitive pay, as a full-time Tesla employee, you are eligible for the following benefits at day 1 of hire:

• Medical plans > plan options with $0 payroll deduction
• Family-building, fertility, adoption and surrogacy benefits
• Dental (including orthodontic coverage) and vision plans, both have options with a $0 paycheck contribution
• Company Paid (Health Savings Accounts) HSA Contribution when enrolled in the High-Deductible medical plan with HSA
• Healthcare and Dependent Care Flexible Spending Accounts (FSA)
• 401(k) with employer match, Employee Stock Purchase Plans, and other financial benefits
• Company paid Basic Life, AD&D
• Short-term and long-term disability insurance (90 day waiting period)
• Employee Assistance Program
• Sick and Vacation time (Flex time for salary positions, Accrued hours for Hourly positions), and Paid Holidays
• Back-up childcare and parenting support resources
• Voluntary benefits to include: critical illness, hospital indemnity, accident insurance, theft & legal services, and pet insurance
• Weight Loss and Tobacco Cessation Programs
• Tesla Babies program
• Commuter benefits
• Employee discounts and perks program

Pay offered may vary depending on multiple individualized factors, including market location, job-related knowledge, skills, and experience. The total compensation package for this position may also include other elements dependent on the position offered. Details of participation in these benefit plans will be provided if an employee receives an offer of employment.